INSIDE Contactless joins NFC Forum’s board of directors
17 December, 2008
category: Contactless, Financial, NFC
The NFC Forum, a non-profit industry association advocating the use of Near Field Communication technology, announced that INSIDE Contactless has become a sponsor member and joined its board of directors. Semiconductor Energy Laboratory Co., Ltd. also joined as Principal Member.
In addition, organizations from across all segments of the NFC global ecosystem have joined as associate members, including mobile handset manufacturers, mobile service providers, payment services providers, chip makers, solution developers, municipalities and academic institutions.
Formerly a principal member, INSIDE Contactless now joins fellow sponsor members HP, MasterCard Worldwide, Microsoft Corp., NEC, Nokia, NTT DOCOMO Inc., NXP Semiconductors, Panasonic, Renesas Technology, Samsung, Sony Corporation and Visa Inc.
Sponsor membership is the highest level of membership in the NFC Forum, with each Sponsor member occupying a seat on the organization’s Board of Directors and gaining the right to designate individuals to run for offices.
New associate members include American Banknote; Arygon; Atrua Technologies, Inc.; austriamicrosystems AG; China Mobile; Collis; COMPRION; Human Chain; Integri; ITN International, Inc.-bCard; JSC People’s Bank of Georgia; Kyocera Wireless Corporation; LGAI Technological Center S.A.; Mobile Payment Systems, LLC; Polaric; Sagem Mobiles; TORO Limited; Toshiba Corp.; Tranzfinity; Trusted Logic; TwinLinx; VELO Information Technology (Shanghai), Inc.; Venyon; Verband Deutscher Verkehrsunternehmen e.V (VDV); Visa Europe; and Vocalink.
Also joining recently are Non-Profit members Cartes Bancaires; City of Oulu (Finland); In-Q-Tel; INSO – Vienna University of Technology; and MBDS, University of Nice Sophia Antipolis.