HID Global announced that its patented crack prevention technology for IC chip-enabled polycarbonate eID and e-passport credentials has been validated in the tests conducted by Smithers Pira.
In laboratory testing, 100% of cards created using HID Global’s crack prevention solution were found to be immune to premature aging caused by the minuscule cracking that in some instances has been known to occur when a chip is introduced to a polycarbonate card body. Cards without the crack prevention technology failed the test.
The company’s crack prevention technology is used in government-to-citizen ID programs, including a flagship deployment of more than 10 million cards for a major European eID program. Polycarbonate, due to its unique strength and flexibility, has won the trust of governments as the material of choice for durability and tamper resistance and is also valued for its capabilities as a platform supporting high quality optical features of security printing.
HID Global’s unique crack prevention feature optimizes the reliability and durability of smart cards and e-passport data pages by enabling government customers to leverage the advantages of smart card technology on a polycarbonate platform and protect their investment by extending the life of the credential.
Smithers Pira Testing combines laboratory testing and simulation facilities. During the course of several years, HID Global’s R&D worked to develop and patent the anti-crack feature. As confirmed in the Smithers Pira report, the process prevents the development and emergence of micro-cracks by creating a cushion or “airbag” effect around the chip while maintaining a format compliant with stringent international standards limiting the size and thickness of machine-readable electronic IDs.