Contactless card manufacturer CPI Card Group has announced it will broaden its portfolio of contactless offerings with technology from NXP Semiconductors and KSW Microtec.
The partnership will give CPI access to NXP Semiconductors’ Fast Pay contactless security chip. Used for contactless payment applications in the U.S. and Canada, Fast Pay features embedded Data Encryption Standard (DES) hardware for boosted security and speedy transaction times.
KSW Microtec will share its Thinlam contactless prelaminate for contactless personal ID card manufacturing. According to CPI, the solution provides exceptional thinness and maintains high reliability and durability thanks to its unique assembly technology.
“In order to provide the best products for our customers, we feel it’s important to offer a variety of technology choices and solutions from reliable partners in the industry,” says Benoit Guez, director of Smart Cards and New Technologies at CPI. “Both NXP and KSW have demonstrated their commitment to developing cutting-edge technologies in the contactless space, and we look forward to working together as a team to meet our clients’ needs, and exceed their expectations.”