The Trüb Group has released the second generation of its CombOS Dual Interface OS for contactless and contact-based EMV compliant smart cards based on new specs from MasterCard and Visa.

The new version lowers transaction times, includes data storage functionalities and increases security. This OS is based on the new M/Chip Advance specification from MasterCard and from Visa’s VSDC v1.5.3 and VCPS 2.1.1.

The main feature of the new OS is faster transaction processing. Contactless transactions with PayPass M/Chip and payWave qVSDC will be 30% faster than the earlier generation of OS. PayPass Magstripe and payWave MSD transactions will be 20% faster. CombOS DI v2 includes backware compatibility with M/Chip 4 and M/Chip 2.

Issuers can choose different types of data storage, including the new MasterCard Data Storage product, a Mifare emulation or standard ISO commands. These capabilities may be used across transport, loyalty, authentication and physical access functions.

Security measures now include the Infineon SLE78 chip with Integrity Guard.

Trüb will offer CombOS DI in September 2012.