Smart Packaging Solutions (SPS) announced it is ready to deliver its to smart card products to manufacturers in China.

This, following the Chinese Government, along with People’s Bank of China (PBOC) confirmation that all banking cards in China would use smart card technologies by 2015. PBOC has already published the specification for these cards, called PBOC 2.0, which includes the certification scheme.

SPS developed a dedicated smart card platform, including dual technology, complete with chips supporting the JavaCard-based PBOC 2.0 operating system, and inlays benefitting from the EBooster technology.

The SPS platform consists in a micro-module with contacts for EMV contact transactions integrating a small antenna, and an inlay with a full card size antenna, coupled with the small antenna, allowing an efficient communication in contactless mode between the card and the reader. And because there is no physical connection between both antennas, cards are reliable, and even allow five lines of embossing in the ISO-defined area.

SPS is ready to deliver its EBooster platforms for certification by China UnionPay, and to engage in mass production from the second half of 2012.