Smart Packaging Solutions (SPS) announced that its SPS EBooster technology has been recognized with 15 additional Visa and MasterCard certifications obtained in 2011.

SPS EBooster technology enables smart card manufacturers to deliver dual-interface cards – contact & contactless – to financial institutions issuing banking cards. This ensures smart card manufacturers are able to adapt to market demand and that they are able to deliver banking cards fitting all customer requirements.

The SPS platform consists in a micro-module with contacts for EMV transactions by integrating a small antenna, and an inlay with a full card size antenna, coupled with the small antenna, allowing communication in contactless mode. This way, and because there is no physical connection between both antennas, cards are reliable, and even allow five lines of embossing in the ISO-defined area.

With SPS EBooster technology, smart card manufacturers are given a full set of options including the ability to select between major semi conductor vendors, and the option to choose native, JavaCard or Multos based operating systems.